Semiconductor package and camera module

ABSTRACT

Three terminals t1, t2, and t4 are individually arranged on a semiconductor package 10 having a rectangular shape as viewed in plan in such a manner that the center in the longitudinal direction of the semiconductor package 10 of each of the three terminals t1, t2, and t4 and the center in the longitudinal direction of each of the other terminals are not overlapped with each other as viewed from the side of the long side. The terminal t4 and the other terminals t1 and t2 are arranged in such a manner that the terminal t4 and the other terminals t1 and t2 are present on mutually different sides across a line segment M passing through the center in the width direction, an angle θ formed by two line segments connecting the center of gravity of the terminal t4, the position in the longitudinal direction of which is the center, and the center of gravity of each of the other terminals t1 and t2 is 60° or more, and a width L1 of the semiconductor package 10 and a distance Lt between the rightmost end position of the terminal t4 arranged at the rightmost end in the width direction of the semiconductor package 10 and the leftmost end position of the terminal t1 or t2 arranged at the leftmost position in the width direction satisfy Lt/L1≤0.5.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a semiconductor package and a cameramodule including the semiconductor package.

Description of the Related Art

In recent years, a camera module 2 is mounted in a mobile terminal 1,such as a smartphone or a cellular phone, as illustrated in FIG. 5. Thecamera module 2 has a lens 3 of a camera, semiconductor packages 4 aeach mounted with a sensor 4 for position detection of the lens 3 andthe like, and a lens control mechanism including a coil 5, a magnet 6,or the like for adjusting the position of the lens 3 and adjusting theposition of the lens 3 as illustrated in FIG. 6. The lens positioncontrol mechanism includes an autofocus mechanism, a hand shakecorrection mechanism, and the like. The lens position control mechanismdetects the position of the lens 3 based on an output signal of thesensor 4 for position detection and the like, and then adjusts theposition of the lens 3 in such a manner that the lens 3 is located at atarget position (for example, see PTL 1).

In the camera module 2, constituent components configuring the lensposition control mechanism are arranged along the periphery of a lensholder 3 a supporting the lens 3 as viewed in plan or, as illustrated ina schematic view of FIG. 7, the lens 3, the semiconductor packages 4 aeach mounted with the sensor 4 for position detection and the like, thelens position control mechanism, and the like are configured as oneunit.

CITATION LIST Patent Literature

PTL 1: JP 2017-58523 A

SUMMARY OF THE INVENTION

Nowadays, the mobile terminal 1 has been demanded to enhance theperformance of a camera and reduce the thickness.

As a measure for the enhancement of the performance of the camera, amethod for increasing the aperture of the lens 3 is mentioned. However,it is necessary to arrange the sensor 4 for position detection and theconstituent components included in the lens position control mechanism,such as the coil 5 and the magnet 6, around the lens 3 as illustrated inFIG. 6. Therefore, when the aperture of the lens 3 is increased, thesize of the camera module 2 is also increased. When the camera module 2is unitized as illustrated in FIGS. 8A and 8B, the unit size of thecamera module 2 needs to increase, and therefore the demand for the sizereduction of the mobile terminal 1 cannot be satisfied.

Herein, as one method for achieving the aperture increase of the lens 3without causing the size increase of the camera module 2, a method forreducing the size of the semiconductor package 4 a mounted with thesensor 4 for position detection included in the camera module 2 isconsidered. However, the size reduction of the semiconductor package 4 anamely requires a size reduction of terminals t as illustrated in FIG.9. When the size of the terminals t is reduced, there arises a problemthat the stability in mounting decreases.

The present invention has been made focusing on an unsolved problem of aconventional technology. It is an object of the present invention toprovide a semiconductor package and a camera module, the sizes of whichcan be reduced without reducing the stability in mounting.

To achieve the object, a semiconductor package according to one aspectof the present invention is a semiconductor package of a wafer levelchip size package type, including at least three terminals, in which thesemiconductor package has a long and narrow rectangular shape as viewedin plan, the three terminals are individually arranged in such a mannerthat the center in the longitudinal direction of the semiconductorpackage of each of the three terminals and the center in thelongitudinal direction of each of the other terminals arranged on thesemiconductor package are not overlapped with each other as viewed fromthe side of the long side of the semiconductor package, one terminal andthe other two terminals among the three terminals are present ondifferent sides across a line segment passing through the center in thewidth direction of the semiconductor package, an angle formed by twoline segments connecting the center of gravity of the terminal, theposition in the longitudinal direction of which is the center, among thethree terminals and the center of gravity of each of the other twoterminals is 60° or more, and a width L1 of the semiconductor packageand a distance Lt between the rightmost end position of the terminalarranged at the rightmost end in the width direction of thesemiconductor package among the three terminals and the leftmost endposition of the terminal arranged at the leftmost end in the widthdirection satisfy Lt/L1≥0.5.

Moreover, a camera module according to another aspect of the presentinvention has two or more the semiconductor packages of theabove-described aspect, in which the semiconductor packages are arrangedalong the periphery of an adjustment mechanism adjusting the lensposition of a camera as viewed in plan and the longitudinal directionsof the semiconductor packages are orthogonal to each other.

One aspect of the present invention can achieve a size reduction of asemiconductor package while securing the stability in mounting.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view schematically illustrating an example of asemiconductor package according to one embodiment of the presentinvention.

FIG. 2 is a view for explaining an effect of the semiconductor packageaccording to one embodiment of the present invention.

FIGS. 3A and 3B are views for explaining an effect of the semiconductorpackage according to one embodiment of the present invention.

FIG. 4 is an explanatory view for explaining the arrangement conditionsof the semiconductor package according to one embodiment of the presentinvention.

FIG. 5 is a perspective view illustrating an example of a mobileterminal to which the semiconductor package according to one embodimentof the present invention is applied.

FIG. 6 is a schematic block diagram illustrating an example of a cameramodule.

FIG. 7 is a plan view schematically illustrating an example of aunitized camera module.

FIGS. 8A and 8B are views for explaining a problem of a conventionalsemiconductor package.

FIG. 9 is a view for explaining a problem of a conventionalsemiconductor package.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

In the following detailed description, a large number of particularspecific configurations are described to provide a perfect understandingof an embodiment of the present invention. However, it is clear that theother embodiments can be implemented without being limited to suchparticular specific configurations. Moreover, the following embodimentdoes not limit the present invention according to Claims and includesall the combinations of characteristic configurations described in theembodiment.

Hereinafter, one embodiment of the present invention is described withreference to the drawings. In the following description of the drawings,the same portions are designated by the same reference numerals. Thedrawings are schematically illustrated and the relationship between thethickness and the plane dimension, the ratio of the thickness of eachlayer, and the like are different from the actual relationship, ratio,and the like.

The embodiment of the present invention describes a case where asemiconductor package 10 according to one embodiment of the presentinvention is applied to a semiconductor package 4 a contained in acamera module 2 to be mounted in a mobile terminal 1, such as asmartphone or a cellular phone illustrated in FIG. 5. Although the casewhere the present invention is applied to the mobile terminal 1 isdescribed herein, the present invention is applicable without beinglimited to the mobile terminal 1 and is applicable without being limitedto the camera module.

FIG. 1 is a plan view schematically illustrating an example of thesemiconductor package 10 according to one embodiment of the presentinvention.

The semiconductor package 10 according to one embodiment of the presentinvention is a WLCSP (Wafer Level Chip Size Package) and includes awafer portion 10 a and a plurality of terminals t arranged on the sideof the mounting surface of the wafer portion 10 a as illustrated in FIG.1.

The semiconductor package 10 has a rectangular shape having an aspectratio of about 2 or more and 4 or less as viewed in plan and has a shortside length of 0.35 mm or more and 0.8 mm or less, for example. The“aspect ratio” indicates (Long side length/Short side length). Thesemiconductor package 10 includes the plurality of terminals t and theterminals t are arranged in zigzag and only two arrays are arranged inthe width direction. The width of each terminal t is 0.15 mm or more and0.3 mm or less. The width of the terminal t herein refers to the maximumvalue of the distance between the short sides facing each other when theterminal t is a rectangle as viewed in plan and refers to the diameterof a circle when the terminal t is a circle as viewed in plan. FIG. 1illustrates a case where six terminals t1 to t6 are provided.

Herein, when the terminals t having the same shape as the shape of theterminals t arranged on the semiconductor package 10 illustrated in FIG.1 and having the same number as the number of the terminals t of thesemiconductor package 10 are arranged in a lattice shape as illustratedin FIG. 2, the terminals t need to be arranged at a certain degree ofinterval in relation to wiring and the like. More specifically, it isnecessary to secure an interval ΔL in the width direction of thesemiconductor package 10 between the array of the terminals t arrangedon one side and the array of the terminals t arranged on the other side.

On the other hand, when the terminals t are arranged in zigzag, theterminals t in the longitudinal direction of the semiconductor package10 may be arranged in such a manner that the terminal t arranged on oneside is present between the terminals t arranged on the other side. Inthis case, at least the interval ΔL may be secured between the terminalt on one side and the terminal t on the other side. Therefore, theinterval ΔL may be secured not in the width direction of thesemiconductor package 10 but in a direction crossing the width directionof the semiconductor package 10 between the terminal t1 and the terminalt4, for example. Therefore, the distance in the width direction of thesemiconductor package 10 between the terminal on one side and theterminal on the other side is shorter than the ΔL.

Therefore, the width of the semiconductor package 10 is narrower in thecase where the terminals t are arrange in zigzag as illustrated in FIG.1 than in the case where the terminals t are arranged in the latticeshape as illustrated in FIG. 2 corresponding to the reduction in theinterval in the width direction of the semiconductor package 10 betweenthe terminals on one side and the terminals on the other side (L1<L2, inwhich L1 indicates the width of the semiconductor package (zigzagarrangement) 10 illustrated in FIGS. 1 and L2 indicates the width of thesemiconductor package (lattice shape arrangement) illustrated in FIG.2). More specifically, the size of the semiconductor package 10 can bereduced in the width direction.

At this time, the terminal t of the semiconductor package illustrated inFIG. 1 and the terminal t of the semiconductor package 10 illustrated inFIG. 2 have the same shape and six terminals t are arranged in both thecases. Accordingly, by arranging the terminals t in zigzag asillustrated in FIG. 1, the size of the semiconductor package 10 can bereduced in the width direction while maintaining the same terminal shapeand the same number of terminals. Therefore, even when the size of thesemiconductor package 10 is reduced in the width direction, a reductionin stability in mounting can be suppressed.

When the terminals t are arranged in zigzag, the size of thesemiconductor package 10 can be reduced in the width direction but,conversely, the length in the longitudinal direction increases asillustrated in FIG. 1 and FIG. 2.

Herein, as illustrated in FIG. 3A, the constituent components containedin the camera module 2, such as the semiconductor package 10, arearranged around the lens 3. More specifically, the constituentcomponents are arranged around a lens position control mechanismperforming position control of the lens 3, such as an autofocusmechanism and a hand shake correction mechanism, as illustrated in FIG.6 or FIG. 7.

Moreover, a unit of the camera module 2 comparatively has space in thelongitudinal direction of the semiconductor package 4 a as illustratedin FIG. 3A. Therefore, the size reduction in the longitudinal directionof the semiconductor package 4 a does not contribute to the sizereduction of the unit of the camera module 2. Conversely, the width ofthe unit is mostly determined by the sum of the diameter of the lens 3and the width of the semiconductor package 4 a in the unit of the cameramodule 2 as illustrated in FIG. 3A. Therefore, the use of thesemiconductor package 10 in which the size of the semiconductor package4 a is reduced in the width direction as illustrated in FIG. 3B in placeof the semiconductor package 4 a contributes to the size reduction ofthe camera module 2.

Therefore, as illustrated in FIG. 1, the size reduction of the cameramodule 2 or the unit of the camera module 2 can be achieved by the useof the semiconductor package 10 in which the terminals t are arranged inzigzag. More specifically, an increase in the aperture of the lens 3 canbe achieved without increasing the size of the camera module 2 and theenhancement of the performance of the camera module 2 and the reductionin the thickness of the mobile terminal 1 mounted with the camera module2 can be achieved.

Moreover, the width of the semiconductor package 10 can be reduced byarranging the terminals t in zigzag as described above. Therefore, whenthe size of a unit, such as the unit of the camera module 2, isdetermined by the width of a semiconductor package, the size reductionof the unit can be achieved by the use of the semiconductor package 10according to one embodiment of the present invention as thesemiconductor package.

Moreover, the space between the terminals t is comparatively larger inthe semiconductor package 10 in which the terminals t are arranged inzigzag illustrated in FIG. 1 than in the semiconductor package 10 inwhich the terminals t are arranged in the lattice shape illustrated inFIG. 2. Therefore, the routing of wiring can be further facilitated. Forexample, the degrees of freedom of the arrangement positions ofelectronic components mounted in the semiconductor package 10, such asthe sensor 4 for position detection, and the routing of wiring arehigher.

When a hall element is used as the sensor 4 for position detection andwiring for current supply is connected to any two terminals t of theterminals t1 to t6 in the semiconductor package 10 illustrated in FIG.1, there is a possibility that, when the wiring for current supply andthe hall element are close to each other, for example, the hall elementis affected by a leak magnetic field and the like due to the flow of acurrent through the wiring for current supply, which leads to areduction in the detection accuracy of the sensor 4 for positiondetection. However, the semiconductor package 10 illustrated in FIG. 1has higher degree of freedom of the arrangement position of the sensor 4for position detection and the routing of wiring. Therefore, thereduction in the detection accuracy of the sensor 4 for positiondetection can be prevented by performing the arrangement of the sensor 4for position detection and the routing of wiring in such a manner as toreduce the influence of the leak magnetic field and the like on thesensor 4 for position detection due to the flow of a current through thewiring for current supply. For example, by arranging the sensor 4 forposition detection and the wiring for current supply to be apart fromeach other as far as possible, by setting the directions where a currentflows to be opposite to each other between a pair of wiring for currentsupply to offset the leak magnetic field, or the like, the influencecaused by the leak magnetic field given to the sensor 4 for positiondetection may be reduced. Moreover, also when the arrangement positionsof the sensor 4 for position detection and the like need to bedetermined in consideration of the influence of the leak magnetic fieldof wiring, the degree of freedom of the arrangement position of thesensor 4 for position detection can be made higher because the degree offreedom of the routing of wiring is high in the semiconductor package 10according to one embodiment of the present invention.

Moreover, in the semiconductor package 10 according to one embodiment ofthe present invention, the terminals t are arranged in two arrays in thewidth direction and are arranged in zigzag as illustrated in FIG. 1.More specifically, as viewed from the terminals t belonging to one arrayin the longitudinal direction of the semiconductor package 10, theterminals belonging to the next array are present in the obliquelyupward direction or in the obliquely downward direction and are notpresent in the horizontal direction. Therefore, the wiring can be routedin the horizontal direction of the terminal t, and thus the routing ofwiring is not limited.

Furthermore, the semiconductor package 10 can be more stably mounted inthe case where the terminals t are arranged in the two arrays than inthe case where the terminals t are arranged only in one array.

Moreover, when the terminals t are arranged in zigzag in the two arrays,the arrangement positions of the terminals t belonging to one array andthe terminals t belonging to the other array approach the positions onthe same straight line with a reduction in the interval in the widthdirection of the semiconductor package 10 between the terminals tbelonging to one array and the terminals t belonging to the other array,and thus the stability in mounting decreases. Conversely, the stabilityin mounting increases with an increase in the interval in the widthdirection of the semiconductor package 10 between the terminals tbelonging to one array and the terminals t belonging to the other arraybut the width of the semiconductor package 10 increases. Therefore, whenthe terminals t are arranged in zigzag, the terminals t need to bearranged at positions where both the stability in mounting and the widthof the semiconductor package 10 are satisfied.

In the semiconductor package 10 according to one embodiment of thepresent invention, the terminals t1 to t3 belonging to one array and theterminals t4 to t6 belonging to the other array are arranged to be incontact with a line segment M passing through the center in the widthdirection of the semiconductor package 10 as illustrated in FIG. 1.Therefore, the semiconductor package 10 in which the stability inmounting is not excessively poor and in which the width of thesemiconductor package 10 can be reduced to some extent can be obtained.Although the terminals t are arranged in zigzag to be in contact withthe line segment M in FIG. 1, the arrangement is not limited thereto andthe terminals t may be arranged at positions where the stability can beobtained in mounting and the width of the semiconductor package 10 is adesired value. More specifically, the terminals t may be arranged to beoverlapped with the line segment M as viewed in plan to a degree suchthat the stability in mounting can be obtained or, conversely, theterminals t may be arranged at positions to be somewhat apart from theline segment M to a degree such that the width of the semiconductorpackage 10 can be reduced to some extent.

Moreover, the electronic components mounted in the semiconductor package10, such as the sensor 4 for position detection, are preferably arrangedat a position apart from the terminals t when the influence of a stressis taken into consideration, for example. When the sensor 4 for positiondetection is arranged in a central portion of the semiconductor package10 as illustrated in FIG. 1, for example, the interval between thesensor 4 and the terminals t is longer and the width of thesemiconductor package 10 is smaller in the semiconductor package 10 inwhich the six terminals t are arranged in zigzag illustrated in FIG. 1than in the semiconductor package 10 in which the six terminals arearranged in the lattice shape illustrated in FIG. 2. Accordingly, thewidth of the semiconductor package 10 can be made narrower whilereducing the influence of a stress.

Moreover, the width of the semiconductor package 10 is narrower but thelength in the longitudinal direction of the semiconductor package 10 islonger in the semiconductor package 10 according to one embodiment ofthe present invention than in the semiconductor package 10 in which theterminals t are arranged in the lattice shape as described above.Therefore, the present invention is suitable for a semiconductor packageto be arranged in the portion where there is much space in thelongitudinal direction but there is not much space in the widthdirection of the semiconductor package 10.

FIG. 1 describes that the terminals t are arranged in zigzag. However,when described in detail, the terminals t of the semiconductor package10 are arranged in such a manner that (a) arbitrary three terminals(hereinafter also referred to as three terminals) are individuallyarranged in such a manner that each center of the three terminals t inthe longitudinal direction of the semiconductor package 10 is notoverlapped each other, and each center of the three terminals t in thelongitudinal direction of the semiconductor package 10 and each centerof the other terminals t arranged on the semiconductor package 10 in thelongitudinal direction of the semiconductor package 10 are notoverlapped with each other as viewed from the side of the long side ofthe semiconductor package 10 and one terminal t among the threeterminals t (in FIG. 1, terminal t, the position in the longitudinaldirection of which is the center) and the other two terminals arepresent on mutually different sides across the line segment M passingthrough the center in the width direction of the semiconductor package10, (b) an angle θ formed by two line segments connecting the gravity ofthe terminal t positioned in a center in the longitudinal direction ofthe semiconductor package 10 among the three terminals t and the gravityof each of the other two terminals t is equal to or larger than athreshold value (for example, about 60°), and further (c) the width L1of the semiconductor package 10 and the distance Lt between therightmost end position of the terminal t arranged at the rightmost endposition in the width direction of the semiconductor package 10 amongthe three terminals t and the leftmost end position of the terminal tarranged at the leftmost end position in the width direction satisfyLt/L1÷0.5. More specifically, among the arbitrary three terminals t,e.g., the terminals t1, t2, and t4, the terminal t1, for example, isarranged in such a manner that each of the center in the longitudinaldirection of the semiconductor package 10 of the terminals t1, t2 and t4is not overlapped each other and each of the center in the longitudinaldirection of the semiconductor package 10 of the terminals (terminalst1, t2 and t4 in the case of FIG. 4) and each of the other terminals t(t3, t5, t6) arranged on the semiconductor package 10 are not overlappedwith each other as viewed from the side of the long side of thesemiconductor package 10 and the other two terminals t2 and t4 among thethree terminals t are similarly arranged as illustrated in FIG. 4.

Furthermore, with respect to the three terminals t1, t2, and t4, theterminals t1 and t2 are arranged on the left side across the linesegment M and the terminal t4 is arranged on the right side across theline segment M as illustrated in FIG. 4. Moreover, the angle θ formed bythe line segment connecting the gravity of the terminal t4 positioned ina center in the longitudinal direction of the semiconductor package 10,among the three terminals and the gravity of the terminal t1 and theline segment connecting the gravity of the terminal t4 and the gravityof the terminal t2 is equal to or larger than the threshold value andthe width L1 of the semiconductor package 10 and the distance Lt betweenthe leftmost end position of the terminal t1 or t2 and the rightmost endposition of the terminal t4 satisfy Lt/L1≥0.5. The description “presenton mutually different sides across the line segment M passing throughthe center in the width direction of the semiconductor package 10” meansthat the centers of gravity of the terminals t1, t2, and t4 are presenton different sides across the line segment M. The description “arrangedin such a manner that each of the center in the longitudinal directionof the semiconductor package 10 of the three terminals t is notoverlapped and each of the centers in the longitudinal direction of thesemiconductor package 10 of the three terminals t and each center in thelongitudinal direction of the semiconductor package 10 of the otherterminals t arranged on the semiconductor package 10 are not overlappedwith each other as viewed from the side of the long side of thesemiconductor package 10” namely means that the three terminals t1, t2,and t4 may be arranged in such a manner that the wiring is not blockedby the other terminals t even when connected by drawing out the wiringfrom either the right or left side with respect to the three terminalst1, t2, and t4. Due to the fact that the three terminals t1, t2, and t4are arranged as described above, the degree of freedom of the routing ofwiring on the semiconductor package 10 can be secured. For example, theterminals t are arranged in such a manner that the interval between thecenters in the longitudinal direction of the terminals t as viewed fromthe side of the long side of the semiconductor package 10 is 100 μm ormore. The upper limit of the interval is not specified. However, theterminals t are arranged in such a manner that the interval between thecenters in the longitudinal direction of the terminals t as viewed fromthe side of the long side of the package 10 is smaller than the longside of the semiconductor package 10.

Herein, when focused on the three terminals t1, t2, and t4, the terminalt4 is arranged on the right side and the terminals t1 and t2 arearranged on the left side across the line segment M and the numbers ofthe terminals t on the right and left sides are different from eachother as illustrated in FIG. 4. More specifically, from the viewpoint ofthe number of the terminals t, the stability in the horizontal directionacross the line segment M appears lower than in the case where thenumbers of the terminals t on the right and left sides across the linesegment M are the same. However, the three terminals, t1, t2, and t4 arearranged so that the angle θ formed by the line segment connecting theterminals t1 and t4 and the line segment connecting the terminals t2 andt4 is equal to or larger than a threshold value and the angle θ based onthe terminal t4 positioned at the center in the longitudinal directionof the semiconductor package 10 is equal to or larger than a thresholdvalue. Therefore, although the numbers of the terminals t on the rightand left sides across the line segment M are different from each other,the stability in the horizontal direction can be secured and thestability also in the longitudinal direction can be secured. Morespecifically, even when the number of the terminals t is set to 3, thestability in the horizontal direction can be sufficiently secured.

Therefore, even when the number of terminals is 3, the stability inmounting of the semiconductor package 10 can be secured. Morespecifically, the number of the terminals t to be provided on thesemiconductor package 10 may be at least 3 from the viewpoint of thestability in mounting and therefore there is no necessity of providingan unnecessary terminal, and thus the size in the longitudinal directionof the semiconductor package 10 can also be correspondingly reduced.When the three terminals t satisfying the above-described arrangementconditions (a) to (c) or a comparatively small number of terminals tincluding the three terminals t are provided on the semiconductorpackage 10, the two terminals t among the three terminals t satisfyingthe above-described arrangement conditions (a) to (c) are preferablyindividually arranged in the vicinity of both ends in the longitudinaldirection of the semiconductor package 10.

Moreover, the terminals t1, t2, and t4 are arranged in such a mannerthat the distance Lt between the rightmost end of the terminal t4 andthe leftmost end of the terminals t1 and t2 and the width L1 of thesemiconductor package 10 satisfy Lt/L1≥0.5 and the terminals t1, t2, andt4 are arranged in such a manner that the distance Lt in the horizontaldirection between the terminals t1, t2, and t4 is at least ½ or more ofthe width L1 of the semiconductor package 10. Therefore, the stabilityin mounting in the horizontal direction can be further secured.

In the three terminals t1, t2, and t4, the distance in the longitudinaldirection between the terminals t1 and t4 may be different from thedistance in the longitudinal direction between the terminals t2 and t4as viewed in plan.

Moreover, the terminals t1 and t2 do not necessarily need to be arrangedon the same straight line along the longitudinal direction of thesemiconductor package 10 and the terminal t2 may be arranged at aposition close to the line segment M or on the line segment M as viewedin plan.

Although the terminal t4, the position in the longitudinal direction ofthe semiconductor package 10 is the center, among the terminals t1, t2,and t4 is arranged on the right side across the line segment M and theremaining terminals t1 and t2 are arranged on the left side across theline segment M as the arrangement satisfying the above-describedarrangement condition (a) in FIG. 4, the arrangement is not limitedthereto.

For example, in FIG. 4, the terminal t1, the terminal t4, and theterminal t5 instead of the terminal t2 may be set as one set of thethree terminals t satisfying the above-described arrangement conditions(a) to (c). More specifically, the terminal t1, the position in thelongitudinal direction of the semiconductor package 10 of which is anend portion, may be arranged on the left side across the line segment Mand the remaining terminals t4 and t5 may be arranged on the right sideacross the line segment M. However, it is more preferable from theviewpoint of the stability in the width direction of the semiconductorpackage 10 that the terminal t4, the position in the longitudinaldirection of the semiconductor package 10 is the center, is arranged onone side across the line segment M and the remaining two terminals arearranged on the other side across the line segment M as in the terminalst1, t2, and t4.

When four or more terminals t are arranged, the other terminals t exceptthe three terminal t1, t2, and t4 satisfying the above-describedarrangement conditions (a) to (c) may be arranged at positions where thecenter in the longitudinal direction of the semiconductor package 10 ofeach of the three terminals t1, t2, and t4 is not overlapped each other,and the center in the longitudinal direction of the semiconductorpackage 10 of each of the three terminals t1, t2, and t4 and the centerin the longitudinal direction of the semiconductor package 10 of each ofthe other terminals t except the three terminals t1, t2, and t4 are notoverlapped with each other as viewed from the side of the long side ofthe semiconductor package 10. For example, in the set of the threeterminals t1, t4, and t5 satisfying the above-described arrangementconditions (a) to (c), the terminal t may be arranged at the position ofthe t2 in FIG. 4. In this case, the center in the longitudinal directionof the semiconductor package 10 of each of the terminals t1, t4, and t5and the center in the longitudinal direction of the semiconductorpackage 10 of the terminal t2 are not overlapped with each other asviewed from the side of the long side of the semiconductor package 10.

Moreover, a new terminal may be arranged between the terminal t5 and aterminal t6 in FIG. 4.

It is preferable from the viewpoint of the degree of freedom of therouting of wiring that all the terminals t arranged on the semiconductorpackage 10 containing the three terminal t1, t2, and t4, for example,satisfying the above-described arrangement conditions (a) to (c) arearranged at positions where the centers in the longitudinal direction ofthe semiconductor package 10 of the terminals t are not overlapped witheach other as viewed from the side of the long side of the semiconductorpackage 10. The terminals t may not be arranged at equal intervals inthe longitudinal direction.

The other terminals t except the three terminal t1, t2, and t4 may alsobe arranged to satisfy the arrangement conditions (a) to (c) as with thethree terminals t1, t2, and t4 while forming one set by the threeterminals t. More specifically, the terminals t may be arranged so thattwo or more of the sets of the terminals t satisfying the arrangementconditions (a) to (c) may be present. Moreover, the terminals t may bearranged to satisfy the arrangement conditions (a) to (c) in each of allthe combinations obtained by selecting three terminals t containing twoterminals t arranged on the right and left sides across the line segmentM. When two or more of the sets of the three terminals t satisfying thearrangement conditions (a) to (c) are arranged, one set is preferablyarranged in the vicinity of each of both ends in the longitudinaldirection of the semiconductor package 10.

When a plurality of number of the terminals t are arranged in such amanner as to satisfy the arrangement conditions (a) to (c), it ispreferable to arrange the terminals t so that the sum of the number ofthe terminals t arranged on each of the right and left sides across theline segment M is the same. By arranging the terminals t as describedabove, also due to the fact that the numbers of the terminals t on theright and left sides are equal to each other, the stability in mountingof the semiconductor package 10 can be improved.

Although the embodiment described above describes the case where the sixterminals t are provided, the number of the terminals t is not limitedto six and the present invention is applicable even in the case of thesemiconductor package 10 including an arbitrary number, 4 or more and 10or less, of the terminals t, such as four terminals t, six terminals t,eight terminals t, and ten terminals t. The number of the terminals t ispreferably an even number to stabilize the balance in the widthdirection of the semiconductor package 10 in mounting.

The sensor 4 for position detection is not limited to the case of beingmounted in the semiconductor package 10 and may be formed separatelyfrom the semiconductor package 10.

The semiconductor package 10 may be stored in the unit as illustrated inFIG. 7 and may be arranged on the outside of a member supporting thelens 3 as with the coil 5 or the magnet 6 as illustrated in FIG. 6.

The semiconductor package 10 is not limited to one mounted with thesensor 4 for position detection and may be mounted with the otherelectronic components.

As described above, the embodiment of the present invention is describedbut the above-described embodiment describes devise and methods forembodying the technical idea of the present invention and the technicalidea of the present invention does not specify the materials, shapes,structures, arrangement, and the like of constituent components. Thetechnical idea of the present invention can be variously altered withinthe technical scope specified by Claims.

DESCRIPTION OF REFERENCE NUMERALS

1 mobile terminal

2 camera module

3 lens

4 sensor for position detection

4 a semiconductor package

5 coil

6 magnet

10 semiconductor package

10 a wafer portion

t1 to t6 terminal Page 2

1. A semiconductor package of a wafer level chip size package type, thesemiconductor package comprising at least three terminals, wherein thesemiconductor package has a long and narrow rectangular shape as viewedin plan, the three terminals are individually arranged in such a mannerthat an each center of the three terminals in a longitudinal directionof the semiconductor package is not overlapped and the each center ofthe three terminals in a longitudinal direction of the semiconductorpackage and an each center in the longitudinal direction of otherterminals arranged on the semiconductor package are not overlapped witheach other as viewed from a side of a long side of the semiconductorpackage, one terminal and other two terminals among the three terminalsare present on different sides across a line segment passing through acenter in a width direction of the semiconductor package, an angleformed by two line segments connecting a gravity of the terminalpositioned in a center in the longitudinal direction, among the threeterminals and a gravity of each of the other two terminals is 60° ormore, and a width L1 of the semiconductor package and a distance Ltbetween a rightmost end position of the terminal arranged at therightmost end in the width direction of the semiconductor package amongthe three terminals and a leftmost end position of the terminal arrangedat the leftmost end in the width direction satisfy Lt/L1≥0.5.
 2. Thesemiconductor package according to claim 1, wherein the terminals arearranged in zigzag along the longitudinal direction of the semiconductorpackage, and only two arrays are arranged in the width direction.
 3. Thesemiconductor package according to claim 1, wherein an aspect ratio is 2or more and 4 or less, a short side is 0.35 mm or more and 0.8 mm orless, and a width of the terminal is 0.15 mm or more and 0.3 mm or less.4. The semiconductor package according to claim 1, wherein thesemiconductor package includes 4 or more and 10 or less terminals as theterminals.
 5. The semiconductor package according to claim 1, whereinthe semiconductor package includes a sensor.
 6. A camera modulecomprising: two or more of the semiconductor packages according to claim1, wherein the semiconductor packages are arranged along a periphery ofan adjustment mechanism adjusting a lens position of a camera as viewedin plan, and the longitudinal directions of the semiconductor packagesare orthogonal to each other.
 7. The semiconductor package according toclaim 2, wherein an aspect ratio is 2 or more and 4 or less, a shortside is 0.35 mm or more and 0.8 mm or less, and a width of the terminalis 0.15 mm or more and 0.3 mm or less.
 8. The semiconductor packageaccording to claim 2, wherein the semiconductor package includes 4 ormore and 10 or less terminals as the terminals.
 9. The semiconductorpackage according to claim 3, wherein the semiconductor package includes4 or more and 10 or less terminals as the terminals.
 10. Thesemiconductor package according to claim 2, wherein the semiconductorpackage includes a sensor.
 11. The semiconductor package according toclaim 3, wherein the semiconductor package includes a sensor.
 12. Thesemiconductor package according to claim 4, wherein the semiconductorpackage includes a sensor.